Ultra-high vacuum multi-chamber connection system
We will introduce energy semiconductor device research and development systems compatible with φ4-inch substrates!
We would like to introduce our "Ultra High Vacuum Multi-Chamber Connection System." The UHV integrated system connects multiple film deposition and analysis devices to a chamber for ultra-high vacuum transport, including ALD, ECR plasma treatment, sputtering devices, and XPS analysis devices. Additionally, there are systems that connect MEB chambers with XPS surface analysis devices, as well as systems that connect MBE chambers with oxidation treatment chambers and STM analysis chambers. 【Product Lineup】 ■ ALD, Plasma Treatment, Sputtering, Surface Analysis System ■ MBE Growth, XPS Surface Analysis System ■ MBE Growth, Oxidation Treatment, STM Analysis System *For more details, please refer to the PDF document or feel free to contact us.
- 企業：ケニックス
- 価格：Other
